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US 2026/0305480 A1Published application
Micro package structure
AssigneeHue Inc.
InventorYang YUE
Life of this patent
Estimating the term…
Abstract
A micro package structure includes a micro LED panel including an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and a seal structure formed between an edge of the micro LED panel and an edge of the top cover plane around the micro LED array area.
Claims21
1-20. (canceled)
A micro package structure, comprising:
- a micro LED panel comprising an IC (integrated circuit) substrate and a micro LED array area formed on the IC substrate;
- a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane;
- and
- a light shielding layer formed on an edge surface of the top cover plane.
1 more element
Dependencies are inferred from the claim text.