H10W 72/932
Plan-view shape, i.e. in top view
Official title: {Plan-view shape, i.e. in top view}
H10W72/932 (Plan-view shape, i.e. in top view) appears on 8,983 US grants and 8,666 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,983
- Published applications
- 8,666
- Assignees
- 1,349
- Inventors
- 12,745
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 12 | 0 |
| 1985 | 14 | 0 |
| 1986 | 17 | 0 |
| 1987 | 11 | 0 |
| 1988 | 5 | 0 |
| 1989 | 30 | 0 |
| 1990 | 45 | 0 |
| 1991 | 53 | 0 |
| 1992 | 60 | 0 |
| 1993 | 67 | 0 |
| 1994 | 90 | 0 |
| 1995 | 89 | 0 |
| 1996 | 90 | 0 |
| 1997 | 98 | 0 |
| 1998 | 152 | 0 |
| 1999 | 176 | 0 |
| 2000 | 234 | 0 |
| 2001 | 209 | 124 |
| 2002 | 275 | 357 |
| 2003 | 282 | 349 |
| 2004 | 306 | 328 |
| 2005 | 305 | 424 |
| 2006 | 265 | 379 |
| 2007 | 276 | 423 |
| 2008 | 244 | 470 |
| 2009 | 272 | 422 |
| 2010 | 368 | 424 |
| 2011 | 401 | 422 |
| 2012 | 405 | 419 |
| 2013 | 424 | 404 |
| 2014 | 420 | 429 |
| 2015 | 415 | 453 |
| 2016 | 450 | 430 |
| 2017 | 425 | 331 |
| 2018 | 312 | 296 |
| 2019 | 276 | 247 |
| 2020 | 232 | 261 |
| 2021 | 221 | 288 |
| 2022 | 210 | 296 |
| 2023 | 215 | 203 |
| 2024 | 214 | 247 |
| 2025 | 179 | 150 |
| 2026 | 107 | 90 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,790 B2Samsung Electronics Co., Ltd.
- Isolator29 Sep 2026US 12,751,336 B2Kabushiki Kaisha Toshiba
- Signal transmission device and insulated module29 Sep 2026US 12,751,339 B2Rohm Co., Ltd.
- Semiconductor package22 Sep 2026US 12,745,678 B2Samsung Electronics Co., Ltd.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods for fabricating the same8 Oct 2026US 2026/0314446 A1Samsung Electronics Co., Ltd.
- Low resistance structures in systems8 Oct 2026US 2026/0314467 A1Micron Technology, Inc.
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
- Package with t-shaped source electrode1 Oct 2026US 2026/0305387 A1GaNrich Semiconductor Corporation
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993