Isolator
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYusuke Imaizumi, Jia Liu, Yoshinari Tamura
Life of this patent
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Abstract
According to one embodiment, an isolator includes an isolator module including a first substrate, a first insulating layer in contact with a top surface of the first substrate, a second insulating layer in contact with a bottom surface of the first substrate, a first coil arranged at a same height as the first insulating layer, and a second coil arranged at a same height as the second insulating layer and facing the first coil; a first conductor arranged below the isolator module and electrically connected to a bottom surface of the second coil; and a first chip, wherein the second coil and a top surface of the first chip are electrically connected to each other with the first conductor interposed.
Claims16
An isolator comprising:
- an isolator module including a first substrate, a first insulating layer in contact with a top surface of the first substrate, a second insulating layer in contact with a bottom surface of the first substrate, a first coil embedded in the first insulating layer, and a second coil embedded in the second insulating layer and facing the first coil;
- a first conductor arranged below the isolator module and electrically connected to a bottom surface of the second coil;
- and
- a first chip,
- wherein the second coil and a top surface of the first chip are electrically connected to each other via the first conductor.
Dependencies are inferred from the claim text.