H10W 72/951
Materials of bond pads
Official title: {Materials of bond pads}
H10W72/951 (Materials of bond pads) appears on 19,012 US grants and 20,524 published applications in this corpus.
Search patents in H10W- Granted patents
- 19,012
- Published applications
- 20,524
- Assignees
- 2,216
- Inventors
- 23,626
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 16 | 0 |
| 1978 | 9 | 0 |
| 1979 | 8 | 0 |
| 1980 | 9 | 0 |
| 1981 | 7 | 0 |
| 1982 | 6 | 0 |
| 1983 | 7 | 0 |
| 1984 | 8 | 0 |
| 1985 | 11 | 0 |
| 1986 | 11 | 0 |
| 1987 | 20 | 0 |
| 1988 | 19 | 0 |
| 1989 | 30 | 0 |
| 1990 | 38 | 0 |
| 1991 | 57 | 0 |
| 1992 | 58 | 0 |
| 1993 | 48 | 0 |
| 1994 | 72 | 0 |
| 1995 | 79 | 0 |
| 1996 | 108 | 0 |
| 1997 | 114 | 0 |
| 1998 | 196 | 0 |
| 1999 | 248 | 0 |
| 2000 | 375 | 0 |
| 2001 | 486 | 271 |
| 2002 | 600 | 769 |
| 2003 | 668 | 749 |
| 2004 | 674 | 835 |
| 2005 | 604 | 830 |
| 2006 | 570 | 800 |
| 2007 | 550 | 817 |
| 2008 | 478 | 838 |
| 2009 | 476 | 670 |
| 2010 | 629 | 810 |
| 2011 | 639 | 730 |
| 2012 | 669 | 741 |
| 2013 | 724 | 750 |
| 2014 | 738 | 768 |
| 2015 | 769 | 926 |
| 2016 | 826 | 810 |
| 2017 | 871 | 857 |
| 2018 | 741 | 738 |
| 2019 | 724 | 881 |
| 2020 | 808 | 1088 |
| 2021 | 820 | 1133 |
| 2022 | 835 | 1028 |
| 2023 | 824 | 779 |
| 2024 | 762 | 831 |
| 2025 | 595 | 685 |
| 2026 | 372 | 390 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Semiconductor package and manufacturing method thereof6 Oct 2026US 12,757,764 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
- Semiconductor structures with through via8 Oct 2026US 2026/0314366 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Layer-by-layer formation of through-substrate via8 Oct 2026US 2026/0314369 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009