H10W 72/957
Multiple bond pads having different materials
Official title: {Multiple bond pads having different materials}
H10W72/957 (Multiple bond pads having different materials) appears on 143 US grants and 179 published applications in this corpus.
Search patents in H10W- Granted patents
- 143
- Published applications
- 179
- Assignees
- 88
- Inventors
- 314
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 2 |
| 2006 | 1 | 2 |
| 2007 | 0 | 1 |
| 2008 | 3 | 4 |
| 2009 | 2 | 6 |
| 2010 | 1 | 4 |
| 2011 | 3 | 6 |
| 2012 | 4 | 7 |
| 2013 | 12 | 3 |
| 2014 | 8 | 6 |
| 2015 | 4 | 10 |
| 2016 | 8 | 10 |
| 2017 | 11 | 10 |
| 2018 | 11 | 10 |
| 2019 | 5 | 8 |
| 2020 | 12 | 5 |
| 2021 | 4 | 8 |
| 2022 | 8 | 19 |
| 2023 | 6 | 14 |
| 2024 | 13 | 16 |
| 2025 | 8 | 14 |
| 2026 | 11 | 9 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Semiconductor structure and fabrication method thereof25 Aug 2026US 12,721,210 B2United Microelectronics Corp.
- 3D fan-out packaging structure of interconnection system with ultra-high density and method for manufacturing the same18 Aug 2026US 12,713,967 B2SJ Semiconductor(Jiangyin) Corporation
- Semiconductor device with advanced pad structure and method for forming same11 Aug 2026US 12,706,251 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronic assemblies with inductors in direct bonding regions4 Aug 2026US 12,701,724 B2Intel Corporation
- Semiconductor device with advanced pad structure and method for forming same1 Oct 2026US 2026/0302085 A1Taiwan Semiconductor Manufacturing Company.Ltd
- 3D fan-out packaging structure of interconnection system with ultra-high density and method for manufacturing THE same1 Oct 2026US 2026/0305450 A1SJ Semiconductor(Jiangyin) Corporation
- Semiconductor devices with bonding structures and methods for forming the same30 Apr 2026US 2026/0123558 A1Yangtze Memory Technologies Co., Ltd.
- Nonvolatile memory device and memory package including the same23 Apr 2026US 2026/0112415 A1Samsung Electronics Co., Ltd.
- Semiconductor package9 Apr 2026US 2026/0101763 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Low cost chip size package and method of fabricating the same204US 6,181,569 B22001
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- Stacked packages151US 6,977,440 B2Tessera, Inc. · 2005
- Semiconductor device and method of fabricating the same96US 6,573,598 B2Oki Electric Industry Co., Ltd. · 2003
- Low cost chip size package and method of fabricating the same82US 6,350,668 B12002