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US 12,757,744 B2Granted
Semiconductor structure and alignment method thereof
AssigneeUnited Microelectronics Corp.
InventorsChiao-Yi Teng, Kun-Ju Li
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Abstract
The invention provides a semiconductor structure, which comprises a first chip and a second chip attached to each other, wherein the first chip comprises a quantum dot pattern, and the second chip comprises a through silicon via (TSV), wherein the quantum dot pattern and the through silicon via are aligned with each other.
Claims18
A semiconductor structure comprising:
- a first chip and a second chip attached to each other, wherein the first chip contains a quantum dot pattern and the second chip contains a through silicon via (TSV), wherein the quantum dot pattern and the through silicon via are aligned with each other;
- and
- a waveguide material disposed in the through silicon via, wherein the waveguide material comprises an outer layer and an inner layer, and wherein the outer layer has a lower refractive index than the inner layer such that light is totally reflected in the waveguide material.
An alignment method of a semiconductor structure, comprising:
- providing a first chip, wherein a surface on the first chip comprises a quantum dot pattern;
- providing a second chip, which includes a through silicon via penetrating the second chip;
- aligning and attaching the first chip and the second chip, wherein the quantum dot pattern and the through silicon via are aligned with each other;
- and
- performing an etching step to remove the quantum dot pattern on the first chip and the through silicon via of the second chip after the first chip and the second chip are bonded to each other.
2 more elements
Dependencies are inferred from the claim text.