Bondable pillars for wire bonds in a semiconductor package

A memory package, comprising:

• a substrate including a plurality of first electrical contacts;
• a plurality of bondable pillars, wherein each bondable pillar, of the plurality of bondable pillars, is coupled to a corresponding first electrical contact, of the plurality of first electrical contacts;
• a memory controller coupled to the substrate;
• a memory die stack coupled to the substrate and including a plurality of memory dies and a plurality of second electrical contacts;
• and
• a plurality of wire bonds electrically coupling the memory die stack to the memory controller,
• wherein each wire bond, of the plurality of wire bonds, bonds a second electrical contact, of the plurality of second electrical contacts, to a bondable pillar, of the plurality of bondable pillars;
• and
• wherein a distal end of each bondable pillar, of the plurality of bondable pillars, is disposed approximately 30 micrometers below, in a direction, a corresponding second electrical contact, of the plurality of second electrical contacts, to which the bondable pillar is electrically coupled via a corresponding wire bond, of the plurality of wire bonds.

A method, comprising:

• receiving a substrate including a plurality of first electrical contacts;
• bonding a plurality of bondable pillars to the substrate, wherein each bondable pillar, of the plurality of bondable pillars, is bonded to a corresponding first electrical contact, of the plurality of first electrical contacts;
• coupling one or more dies to the substrate, the one or more dies including a plurality of second electrical contacts;
• and
• bonding the one or more dies to the plurality of bondable pillars via a plurality of wire bonds,
• wherein each wire bond, of the plurality of wire bonds, bonds a second electrical contact, of the plurality of second electrical contacts, to a bondable pillar, of the plurality of bondable pillars;
• and
• wherein bonding the one or more dies to the plurality of bondable pillars via the plurality of wire bonds includes connecting each second electrical contact, of the plurality of second electrical contacts, to a distal end of a corresponding bondable pillar, of the plurality of bondable pillars, that is disposed approximately 30 micrometers below, in a direction, the second electrical contact.

A method, comprising:

• forming a substrate including a lead frame having a plurality of lead fingers;
• and
• bonding a plurality of bondable pillars to the substrate,
• wherein each bondable pillar, of the plurality of bondable pillars, is bonded to a corresponding lead finger, of the plurality of lead fingers, and
• wherein the plurality of bondable pillars is configured to bond to wire bonds electrically coupling the plurality of lead fingers to a corresponding plurality of electrical contacts associated with one or more dies.