H10W 72/953
Not comprising solid metals or solid metalloids
Official title: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
H10W72/953 (Not comprising solid metals or solid metalloids) appears on 1,212 US grants and 1,615 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,212
- Published applications
- 1,615
- Assignees
- 308
- Inventors
- 2,422
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 2 |
| 2005 | 2 | 2 |
| 2006 | 3 | 4 |
| 2007 | 1 | 35 |
| 2008 | 1 | 9 |
| 2009 | 2 | 5 |
| 2010 | 4 | 14 |
| 2011 | 9 | 10 |
| 2012 | 6 | 36 |
| 2013 | 23 | 52 |
| 2014 | 49 | 62 |
| 2015 | 53 | 69 |
| 2016 | 61 | 76 |
| 2017 | 82 | 85 |
| 2018 | 70 | 91 |
| 2019 | 88 | 100 |
| 2020 | 89 | 138 |
| 2021 | 107 | 179 |
| 2022 | 129 | 183 |
| 2023 | 133 | 137 |
| 2024 | 130 | 144 |
| 2025 | 107 | 116 |
| 2026 | 58 | 63 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and manufacturing method thereof6 Oct 2026US 12,757,764 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2Materials Technology Corporation
- Direct hybrid bond pad having tapered sidewall29 Sep 2026US 12,751,328 B2Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor device and method for manufacturing the same15 Sep 2026US 12,740,472 B2Samsung Electronics Co., Ltd.
- Electronic device and manufacturing method of the same15 Sep 2026US 12,740,474 B2Innolux Corporation
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor capacitor for stacked pixel1 Oct 2026US 2026/0304992 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing 3dic package comprising a plurality of discrete device dies bonding to a wafer1 Oct 2026US 2026/0305486 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device24 Sep 2026US 2026/0293757 A1Resonac Corporation
Most cited
By later US patents
- Hybrid bonding mechanisms for semiconductor wafers261US 9,142,517 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Wafer-to-wafer bonding structure256US 9,461,007 B2Samsung Electronics Co., Ltd. · 2016
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Conductive pad structure for hybrid bonding and methods of forming same243US 9,437,572 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process for realizing a connecting structure242US 9,224,704 B2Soitec · 2015