Electronic device and manufacturing method of the same
AssigneeInnolux Corporation
InventorsMing-Chih Tsai, Chen-Yu Lin
Life of this patent
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Abstract
An electronic device includes a substrate, a metal composite structure, a first insulating layer, and a second insulating layer. The metal composite structure is disposed on the substrate and includes a first metal layer. The first metal layer has a first opening. The first insulating layer is disposed on the metal composite structure and has a second opening. The second insulating layer is disposed on the first insulating layer and has a third opening. In a cross section of the electronic device, the first opening has a first distance, the second opening has a second distance, and the third opening has a third distance. The second distance is greater than the third distance, and the third distance is greater than the first distance.
Claims18
An electronic device, comprising:
- a substrate;
- a metal composite structure, disposed on the substrate, and comprising a first metal layer, wherein the first metal layer has a first opening;
- a first insulating layer, disposed on the metal composite structure, and having a second opening;
- and
- a second insulating layer, disposed on the first insulating layer, and having a third opening,
- wherein, in a cross section of the electronic device, the first opening has a first distance, the second opening has a second distance, the third opening has a third distance, the second distance is greater than the third distance, and the third distance is greater than the first distance,
- wherein the metal composite structure further comprises a second metal layer and a third metal layer, the second metal layer is disposed between the first metal layer and the substrate, the third metal layer is disposed between the second metal layer and the substrate, and the first metal layer exposes at least part of the second metal layer,
- wherein the second distance of the second opening is greater than a width of the second metal layer in the cross section of the electronic device.
A manufacturing method of an electronic device, comprising:
- providing a substrate;
- forming a metal composite structure on the substrate, wherein the metal composite structure comprises a first metal layer;
- forming a first insulating layer on the metal composite structure;
- forming a first opening in the first insulating layer;
- forming a second insulating layer on the first insulating layer;
- forming a second opening in the second insulating layer;
- and
- forming a third opening in the first metal layer,
- wherein the first opening overlaps the second opening and the third opening,
- wherein the metal composite structure further comprises a second metal layer and a third metal layer, the second metal layer is disposed between the first metal layer and the substrate, the third metal layer is disposed between the second metal layer and the substrate, and the first metal layer exposes at least part of the second metal layer,
- wherein the second distance of the second opening is greater than a width of the second metal layer in the cross section of the electronic device.
Dependencies are inferred from the claim text.