Package structure and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie Chen, Hsien-Wei Chen
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Abstract
Three-dimensional integrated circuit structures are disclosed. A three-dimensional integrated circuit structure includes a first die, a second die and a device-free die. The first die includes a first device. The second die includes a second device and is bonded to the first die. The device-free die is located aside the second die and is bonded to the first die. The device-free die includes a conductive feature electrically connected to the first die and the second die.
Claims20
A package structure, comprising:
- a bottom die;
- a top die bonded to the bottom die;
- a dielectric encapsulation disposed on the bottom die and laterally surrounding the top die;
- a redistribution layer structure disposed on the top die and the dielectric encapsulation;
- and
- a plurality of through vias penetrating through the dielectric encapsulation to electrically connect the redistribution layer structure and the bottom die, wherein the plurality of through vias are surrounded by a silicon-containing material.
A method of forming a package structure, comprising:
- bonding a top die to a bottom die;
- forming a dielectric encapsulation on the bottom die to laterally surround the top die;
- forming a redistribution layer structure on the top die and the dielectric encapsulation;
- and
- forming a plurality of through vias in the dielectric encapsulation to electrically connect the redistribution layer structure and the bottom die, wherein the plurality of through vias are surrounded by a silicon-containing material, so that the plurality of through vias are separated from the dielectric encapsulation by the silicon-containing material.
A method of forming a package structure, comprising:
- providing a first die;
- bonding a second die to the first die;
- bonding a third die to the first die and aside the second die, wherein the third die has a plurality of through substrate vias;
- forming an encapsulating material on the first die to cover the second die and the third die;
- and
- performing a planarization process to expose the plurality of through substrate vias of the third die, thereby forming an encapsulant laterally surrounding the second die and third die, wherein the plurality of through substrate vias protrude a top surface of the encapsulant after performing the planarization process.
Dependencies are inferred from the claim text.