H10W 72/981
Auxiliary members
Official title: {Auxiliary members, e.g. spacers}
H10W72/981 (Auxiliary members) appears on 2,870 US grants and 3,114 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,870
- Published applications
- 3,114
- Assignees
- 471
- Inventors
- 4,635
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 7 | 0 |
| 1991 | 15 | 0 |
| 1992 | 11 | 0 |
| 1993 | 10 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 12 | 0 |
| 1997 | 17 | 0 |
| 1998 | 23 | 0 |
| 1999 | 30 | 0 |
| 2000 | 32 | 0 |
| 2001 | 40 | 24 |
| 2002 | 54 | 75 |
| 2003 | 60 | 70 |
| 2004 | 55 | 63 |
| 2005 | 44 | 98 |
| 2006 | 50 | 99 |
| 2007 | 66 | 117 |
| 2008 | 63 | 129 |
| 2009 | 72 | 83 |
| 2010 | 86 | 115 |
| 2011 | 96 | 127 |
| 2012 | 113 | 123 |
| 2013 | 141 | 132 |
| 2014 | 124 | 140 |
| 2015 | 134 | 155 |
| 2016 | 157 | 154 |
| 2017 | 166 | 185 |
| 2018 | 153 | 148 |
| 2019 | 150 | 165 |
| 2020 | 151 | 164 |
| 2021 | 130 | 188 |
| 2022 | 143 | 166 |
| 2023 | 134 | 122 |
| 2024 | 139 | 133 |
| 2025 | 98 | 102 |
| 2026 | 47 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor structures including auxetic microstructures and method of forming the same29 Sep 2026US 12,751,291 B2SanDisk Technologies LLC
- Molded thin semiconductor die packages and related methods22 Sep 2026US 12,745,662 B2Semiconductor Components Industries, LLC
- Bump structure and method of making the same8 Sep 2026US 12,733,529 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display device1 Sep 2026US 12,724,310 B2Samsung Display Co., Ltd.
- Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages1 Sep 2026US 12,727,502 B2STATS ChipPAC Pte. Ltd.
- Semiconductor device including bump structure8 Oct 2026US 2026/0314462 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Backlight Unit and Display Device Including the Same1 Oct 2026US 2026/0305467 A1LG Display Co., Ltd.
- Method for forming semiconductor device24 Sep 2026US 2026/0293679 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method of semiconductor device24 Sep 2026US 2026/0293762 A1Kioxia Corporation
- Display device including a pad where a driving chip is mounted3 Sep 2026US 2026/0259459 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Interconnect structure for stacked semiconductor device573US 6,465,892 B1Fujitsu Limited · 2002
- Method for adding plasma treatment on bond pad to prevent bond pad staining problems353US 6,214,717 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2001
- Method for manufacturing an interconnect structure for stacked semiconductor device316US 6,472,293 B2Fujitsu Limited · 2002
- Hybrid bonding mechanisms for semiconductor wafers261US 9,142,517 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Wafer-to-wafer bonding structure251US 9,941,243 B2Samsung Electronics Co., Ltd. · 2018