Molded thin semiconductor die packages and related methods

A method of forming an over pad metallization structure, the method comprising:

• providing a semiconductor substrate comprising a plurality of copper pads on a first side of the semiconductor substrate;
• electroless plating an over pad metallization comprising nickel, palladium, and gold onto each copper pad of the plurality of copper pads;
• electroplating a layer of copper onto the over pad metallization of each copper pad of the plurality of copper pads;
• forming a mold compound over the plurality of copper pads, the over pad metallization of each copper pad, and the layer of copper of each copper pad;
• removing a portion of the mold compound and a portion of the layer of copper of each copper pad of the plurality of copper pads;
• and
• removing the layer of copper of each copper pad to expose the over pad metallization of each copper pad of the plurality of copper pads.

A method of forming an over pad metallization structure, the method comprising:

• providing a semiconductor substrate comprising a plurality of copper pads on a first side of the semiconductor substrate;
• electroless plating an over pad metallization onto each copper pad of the plurality of copper pads;
• forming a mold compound over the plurality of copper pads and the over pad metallization of each copper pad;
• only after electroless plating of the over pad metallization, removing a portion of the mold compound using grinding;
• and
• after the portion of the mold compound is removed, thinning the semiconductor substrate from a second side of the semiconductor substrate opposite the first side.