H10W 72/985
Alignment aids
Official title: {Alignment aids, e.g. alignment marks}
H10W72/985 (Alignment aids) appears on 84 US grants and 108 published applications in this corpus.
Search patents in H10W- Granted patents
- 84
- Published applications
- 108
- Assignees
- 48
- Inventors
- 200
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 0 |
| 2015 | 1 | 7 |
| 2016 | 4 | 4 |
| 2017 | 7 | 5 |
| 2018 | 4 | 6 |
| 2019 | 7 | 2 |
| 2020 | 4 | 8 |
| 2021 | 7 | 13 |
| 2022 | 7 | 13 |
| 2023 | 13 | 14 |
| 2024 | 9 | 13 |
| 2025 | 10 | 12 |
| 2026 | 6 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Wafer bonding method and bonded device structure28 Jul 2026US 12,696,768 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices including bonded semiconductor layers and manufacturing methods of the same16 Jun 2026US 12,660,713 B2Samsung Electronics Co., Ltd.
- Display device including a pad where a driving chip is mounted2 Jun 2026US 12,645,119 B2Samsung Display Co., Ltd.
- Semiconductor device and method for forming the same26 May 2026US 12,642,096 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Driving substrate, micro LED transfer device and micro LED transfer method14 Apr 2026US 12,604,567 B2Hkc Corporation Limited
- Method for forming semiconductor device24 Sep 2026US 2026/0293679 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method of semiconductor device24 Sep 2026US 2026/0293762 A1Kioxia Corporation
- Display device including a pad where a driving chip is mounted3 Sep 2026US 2026/0259459 A1Samsung Display Co., Ltd.
- Semiconductor package and method of manufacturing same18 Jun 2026US 2026/0173408 A1Samsung Electronics Co., Ltd.
- Method of manufacturing semiconductor package including semiconductor chip having internal and external marks9 Apr 2026US 2026/0101766 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same51US 10,381,322 B1SanDisk Technologies LLC · 2019
- Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping26US 9,040,316 B1DECA Technologies Inc. · 2015
- Method of measuring photoresist and bump misalignment18US 6,636,313 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2003
- Patterns of passivation material on bond pads and methods of manufacture thereof9US 8,802,554 B2Marvell World Trade Ltd. · 2014
- Method for aligning micro-electronic components9US 9,601,459 B2Imec Vzw · 2017