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US 8,802,554 B2Granted
Patterns of passivation material on bond pads and methods of manufacture thereof
AssigneeMarvell World Trade Ltd.
InventorSehat Sutardja
Life of this patent
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Abstract
A method includes forming a pad on an electronic component. The pad comprises conductive material. The method further includes providing passivation material on a surface of the conductive material and removing passivation material from the surface to expose portions of the conductive material to form a bond pad comprising conductive material and passivation material.
Claims8
A method comprising:
- forming a pad on an electronic component, wherein the pad comprises conductive material;
- providing passivation material on a surface of the conductive material;
- selectively removing the passivation material from the surface of the conductive material to expose a section of the conductive material;
- and
- subsequent to selectively removing the passivation material from the surface of the conductive material to expose the section of the conductive material, depositing a plurality of spacers on the exposed section of the conductive material to form a bond pad comprising (i) the conductive material and (ii) the plurality of spacers.
2 more elements
Dependencies are inferred from the claim text.