Driving substrate, micro LED transfer device and micro LED transfer method
AssigneeHkc Corporation Limited
InventorsYang Pu, Haoxuan Zheng
Life of this patent
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Abstract
A driving substrate, a micro LED transfer device and a micro LED transfer method are provided. A side surface of the driving substrate is arranged with a binding metal layer, a positioning layer is arranged around the binding metal layer, and a width of the positioning layer at a position away from the driving substrate is less than that a width at a position close to the driving substrate.
Claims17
A micro light-emitting diode (LED) transfer device, comprising:
- a transfer substrate;
- and
- a micro LED, arranged on the transfer substrate and configured for transferring the micro LED to a driving substrate,
- wherein each micro LED comprises two electrodes, and the two electrodes extend to the side away from the transfer substrate;
- and
- wherein an end of each of the two electrodes away from the transfer substrate is in a gradually tapered shape;
- and
- wherein a side surface of the driving substrate is arranged with a binding metal layer, a positioning layer is arranged around the binding metal layer, and a width of the positioning layer at a position away from the driving substrate is less than a width of the positioning layer at a position close to the driving substrate;
- wherein the surface of a side of the transfer substrate arranged with a LED is further arranged with a positioning member adjacent to the LED, the positioning member is composed of two funnel-shaped fixing members, and the two funnel-shaped fixing members are adjacent to each other to form a groove to align with the positioning layer.
A micro LED transfer method, wherein the micro LED comprises an LED chip, and a first electrode and a second electrode arranged on a surface of the LED chip, the micro LED is disposed on a transfer substrate, and the micro LED transfer method comprises:
- providing a driving substrate;
- making a binding metal layer on a side surface of the driving substrate;
- making a positioning layer around the binding metal layer;
- wherein a width of the positioning layer at a position away from the driving substrate is less than a width of the positioning layer at a position close to the driving substrate;
- placing a side of the transfer substrate arranged with the first electrode and the second electrode towards the driving substrate, to make the first electrode and the second electrode move in a direction close to the binding metal layer under an assistance of the positioning layer until the first electrode and the second electrode being aligned with the binding metal layer;
- and
- removing the transfer substrate to transfer the micro LED from the transfer substrate to the driving substrate;
- wherein each of two sides of the LED chip is further arranged with a positioning member composed of two funnel-shaped fixing members, and the positioning member is connected with the micro LED through a fracturing member;
- after placing a side of the transfer substrate arranged with the first electrode and the second electrode towards the driving substrate, to make the first electrode and the second electrode move in a direction close to the binding metal layer under an assistance of the positioning layer until the first electrode and the second electrode being aligned with the binding metal layer, the micro LED transfer method further comprises:
- removing the positioning member by means of an adhesive substrate with an adhesion force greater than a breaking force between the fracturing member and the LED chip;
- wherein the adhesive force of the adhesive substrate is further less than a fixing force between the binding metal layer and the first electrode and/or the second electrode.
Dependencies are inferred from the claim text.