H10W 72/983
Reinforcing structures
Official title: {Reinforcing structures, e.g. collars}
H10W72/983 (Reinforcing structures) appears on 2,357 US grants and 2,457 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,357
- Published applications
- 2,457
- Assignees
- 407
- Inventors
- 3,836
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 7 | 0 |
| 1991 | 15 | 0 |
| 1992 | 11 | 0 |
| 1993 | 10 | 0 |
| 1994 | 12 | 0 |
| 1995 | 9 | 0 |
| 1996 | 12 | 0 |
| 1997 | 16 | 0 |
| 1998 | 23 | 0 |
| 1999 | 29 | 0 |
| 2000 | 32 | 0 |
| 2001 | 40 | 23 |
| 2002 | 52 | 73 |
| 2003 | 58 | 68 |
| 2004 | 54 | 62 |
| 2005 | 44 | 95 |
| 2006 | 47 | 96 |
| 2007 | 63 | 114 |
| 2008 | 63 | 125 |
| 2009 | 70 | 78 |
| 2010 | 82 | 107 |
| 2011 | 92 | 124 |
| 2012 | 105 | 111 |
| 2013 | 130 | 120 |
| 2014 | 115 | 119 |
| 2015 | 110 | 112 |
| 2016 | 120 | 114 |
| 2017 | 124 | 136 |
| 2018 | 108 | 106 |
| 2019 | 115 | 120 |
| 2020 | 111 | 121 |
| 2021 | 85 | 136 |
| 2022 | 107 | 113 |
| 2023 | 92 | 62 |
| 2024 | 93 | 61 |
| 2025 | 54 | 46 |
| 2026 | 21 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor structures including auxetic microstructures and method of forming the same29 Sep 2026US 12,751,291 B2SanDisk Technologies LLC
- Bump structure and method of making the same8 Sep 2026US 12,733,529 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages1 Sep 2026US 12,727,502 B2STATS ChipPAC Pte. Ltd.
- Semiconductor device25 Aug 2026US 12,721,209 B2Rohm Co., Ltd.
- Pad metallization with oxide layer to reduce deformation of conductive films18 Aug 2026US 12,713,960 B2Renesas Electronics Corporation
- Semiconductor device including bump structure8 Oct 2026US 2026/0314462 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Supporting sealant layer structure for stacked die application23 Jul 2026US 2026/0215281 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure9 Jul 2026US 2026/0198341 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor element and semiconductor apparatus2 Jul 2026US 2026/0190985 A1Sony Semiconductor Solutions Corporation
- Semiconductor package using flip-chip technology25 Jun 2026US 2026/0181773 A1Mediatek Inc.
Most cited
By later US patents
- Interconnect structure for stacked semiconductor device573US 6,465,892 B1Fujitsu Limited · 2002
- Method for adding plasma treatment on bond pad to prevent bond pad staining problems353US 6,214,717 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2001
- Method for manufacturing an interconnect structure for stacked semiconductor device316US 6,472,293 B2Fujitsu Limited · 2002
- Hybrid bonding mechanisms for semiconductor wafers261US 9,142,517 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof247US 4,920,074 AHitachi, Ltd. · 1990