H10W 72/987
Flow barriers
Official title: {Flow barriers}
H10W72/987 (Flow barriers) appears on 100 US grants and 113 published applications in this corpus.
Search patents in H10W- Granted patents
- 100
- Published applications
- 113
- Assignees
- 45
- Inventors
- 177
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 2 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 3 |
| 2013 | 1 | 4 |
| 2014 | 4 | 4 |
| 2015 | 7 | 13 |
| 2016 | 9 | 11 |
| 2017 | 16 | 15 |
| 2018 | 10 | 8 |
| 2019 | 11 | 11 |
| 2020 | 8 | 9 |
| 2021 | 10 | 7 |
| 2022 | 5 | 3 |
| 2023 | 5 | 5 |
| 2024 | 3 | 7 |
| 2025 | 3 | 4 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package including stacked chips and method of manufacturing the semiconductor package18 Aug 2026US 12,713,985 B2Samsung Electronics Co., Ltd.
- Display panel and display device including the same7 Oct 2025US 12,439,784 B2Samsung Display Co., Ltd.
- Method for packaging stacking flip chip6 May 2025US 12,293,984 B2Hebei Beixin Semiconductor Technology Co., Ltd.
- Barrier structures between external electrical connectors4 Feb 2025US 12,218,035 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of soldering a semiconductor chip to a chip carrier29 Oct 2024US 12,132,017 B2Infineon Technologies AG
- Hybrid bonding structure, manufacturing method therefor, and semiconductor device27 Aug 2026US 2026/0256012 A1CXMT Corporation
- Solder resist structure to mitigate solder bridge risk9 Oct 2025US 2025/0316572 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor apparatus1 May 2025US 2025/0140719 A1Mitsubishi Electric Corporation
- Under-bump metallization structures and associated methods of formation16 Jan 2025US 2025/0022820 A1STMicroelectronics International N. V.
- Method for Packaging Stacking Flip Chip2 Jan 2025US 2025/0006692 A1Hebei Beixin Semiconductor Technology Co., Ltd.
Most cited
By later US patents
- Semiconductor device and method of manufacture thereof53US 10,043,768 B2Infineon Technologies AG · 2018
- Semiconductor device, fabrication method for a semiconductor device and electronic apparatus17US 8,896,125 B2Sony Corporation · 2014
- Under bump metallurgy (UBM) and methods of forming same17US 9,793,231 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Methods of forming connector pad structures, interconnect structures, and structures thereof9US 9,570,410 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Method for aligning micro-electronic components9US 9,601,459 B2Imec Vzw · 2017