Barrier structures between external electrical connectors

A structure comprising:

• a passivation layer over a substrate;
• a first conductive pad and a second conductive pad over the passivation layer;
• a barrier disposed on the passivation layer between the first conductive pad and the second conductive pad, the barrier vertically overlapping a portion of the first conductive pad, the barrier having interior sidewalls only partially surrounding the first conductive pad in a top-down view, the barrier physically contacting an upper surface of the first conductive pad and an upper surface of the passivation layer;
• and
• a first solder region on the first conductive pad, wherein the first solder region continuously contacts all of the interior sidewalls of the barrier in the top-down view.

A structure comprising:

• a passivation layer over a substrate;
• a first conductive pad and a second conductive pad over an upper surface of the passivation layer;
• a barrier on the passivation layer, the barrier disposed between the first conductive pad and the second conductive pad, the barrier vertically overlapping a portion of the first conductive pad, the barrier physically contacting an upper surface of the first conductive pad;
• and
• a first solder region on the first conductive pad, the barrier laterally surrounding the first solder region except for a singular gap in the barrier in a plan view preventing the barrier from completely laterally surrounding the first solder region in the plan view, the first solder region contacting a sidewall of the barrier.