Method of soldering a semiconductor chip to a chip carrier
AssigneeInfineon Technologies AG
InventorsMichael Stadler, Paul Armand Asentista Calo
Life of this patent
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Abstract
A method of soldering a semiconductor chip to a chip carrier includes arranging a solder deposit including solder and solder flux between a contact portion of the carrier and a contact portion of a chip pad arranged at a surface of the semiconductor chip. Arranging a dielectric layer at the surface of the semiconductor chip. The dielectric layer includes an opening within which the contact portion of the chip pad is exposed. The dielectric layer further includes arranging a solder flux outgassing trench separate from the opening and intersecting with the solder deposit. The method further includes melting the solder deposit which causes liquid solder to be moved over the solder flux outgassing trench for extraction of flux gas.
Claims18
A method of soldering a semiconductor chip to a chip carrier, the method comprising:
- arranging a solder deposit including solder and solder flux between a contact portion of the chip carrier and a contact portion of a chip pad arranged at a surface of the semiconductor chip, wherein a dielectric layer is arranged at the surface of the semiconductor chip and has an opening within which the contact portion of the chip pad is exposed, wherein the dielectric layer further comprises a solder flux outgassing trench arranged separate from the opening and intersecting with the solder deposit;
- and
- melting the solder deposit which causes liquid solder to be moved over the solder flux outgassing trench for extraction of flux gas.
Dependencies are inferred from the claim text.