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US 9,793,231 B2Granted
Under bump metallurgy (UBM) and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Cheng-Hsien Hsieh
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Abstract
A device package includes a die, fan-out redistribution layers (RDLs) over the die, and an under bump metallurgy (UBM) over the fan-out RDLs. The UBM comprises a conductive pad portion and a trench encircling the conductive pad portion. The device package further includes a connector disposed on the conductive pad portion of the UBM. The fan-out RDLs electrically connect the connector and the UBM to the die.
Claims19
A device package comprises:
- a die;
- fan-out redistribution layers (RDLs) over the die;
- an under bump metallurgy (UBM) over the fan-out RDLs, wherein the UBM comprises:
- a conductive pad portion;
- a conductive retaining wall portion laterally separated from and encircling the conductive pad portion, the conductive retaining wall portion having a bottom-most portion physically contacting a conductive element of the fan-out RDLs;
- a trench encircling the conductive pad portion and separating the conductive pad portion and the conductive retaining wall portion, wherein a sidewall of the bottom-most portion of the conductive retaining wall directed away from the trench physically contacts an insulating material;
- and
- a connector disposed on the conductive pad portion of the UBM, wherein the fan-out RDLs electrically connect the connector and the UBM to the die.
5 more elements
A device package comprising:
- a device die;
- a conductive line over and electrically connected to the device die;
- a polymer layer extending over a top surface of the conductive line;
- an under bump metallurgy (UBM) formed on the top surface of the conductive line, wherein the UBM is at least partially exposed by an opening in the polymer layer, and wherein the UBM comprises:
- a conductive pad portion;
- and
- a conductive retaining wall portion forming a ring around the conductive pad portion, wherein the conductive retaining wall portion is separated from the conductive pad portion by a trench, wherein a bottom-most portion of the conductive retaining wall physically contacts the conductive line, and wherein a sidewall of a bottom-most portion of the conductive retaining wall directed away from the trench physically contacts material of the polymer layer;
- and
- a solder ball on the conductive pad portion of the UBM.
6 more elements
A device package comprising:
- a device die;
- a polymer layer over the device die;
- a conductive line in the polymer layer and electrically connected to the device die, wherein the polymer layer covers edges of the conductive line;
- a conductive pad contacting a surface of the conductive line, wherein the conductive pad is exposed by an opening in the polymer layer;
- and
- a conductive retaining wall having a bottom-most portion physically contacting the conductive line and surrounding the conductive pad in a top-down view of the device package, wherein the conductive retaining wall is separated from the conductive pad by a spacing, wherein the spacing is substantially free of any conductive material and surrounds the conductive pad in a top-down view of the device package, and wherein a sidewall of the bottom-most portion of the conductive retaining wall directed away from the spacing physically contacts the polymer layer.
3 more elements
Dependencies are inferred from the claim text.