Methods of forming connector pad structures, interconnect structures, and structures thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen
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Abstract
Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a connector pad structure includes forming an underball metallization (UBM) pad, and increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment. A polymer material is formed over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.
Claims20
A method of forming a connector pad structure, the method comprising:
- forming an underball metallization (UBM) pad;
- increasing a surface roughness of the UBM pad by exposing the UBM pad to a plasma treatment;
- and
- forming a polymer material over a first portion of the UBM pad, leaving a second portion of the UBM pad exposed.
A method of forming an interconnect structure, the method comprising:
- forming a redistribution layer (RDL);
- forming an underball metallization (UBM) pad over a portion of the RDL, a top surface of the UBM pad comprising a first surface roughness;
- altering the first surface roughness of the top surface of the UBM pad to a second surface roughness, the second surface roughness being greater than the first surface roughness;
- forming a polymer material over a first portion of the UBM pad;
- forming a connector over a second portion of the UBM pad;
- and
- reflowing a material of the connector.
A method of forming an interconnect structure, the method comprising:
- forming a contact pad having a surface roughness at a top surface;
- altering the surface roughness of a first portion of the contact pad to increase the surface roughness;
- covering the first portion of the contact pad with a polymer material;
- forming a connector over a second portion of the contact pad not covered by the polymer material;
- and
- reflowing a material of the connector.
Dependencies are inferred from the claim text.