Method for packaging stacking flip chip

A method for packaging stacking a flip chip, comprising:

• welding solder joints at a preset position on a substrate for solder ball bonding;
• uniformly coating a filling material around at least a portion of solder balls on a chip and around at least a portion of the solder joints on the substrate to form a first filling body, the filling material being a polymer composite material comprising an epoxy resin matrix, a curing agent, and a promoter;
• bonding the solder joints and the solder balls such that the at least a portion of the solder balls is covered by the first filling body, and gaps are provided between the at least a portion of the solder balls covered with the first filling body;
• and
• heating and curing the first filling body, and after heating and curing the first filling body, the method further comprises:
• filling a preset area between the chip and the substrate with the filling material, such that an air cavity is formed in a middle between the chip and the substrate, the preset area being an area between the solder balls located on a most periphery and a boundary of the chip.