H10W 72/941
Dispositions of bond pads
Official title: {Dispositions of bond pads}
H10W72/941 (Dispositions of bond pads) appears on 23,698 US grants and 27,372 published applications in this corpus.
Search patents in H10W- Granted patents
- 23,698
- Published applications
- 27,372
- Assignees
- 2,154
- Inventors
- 24,007
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 8 | 0 |
| 1991 | 15 | 0 |
| 1992 | 19 | 0 |
| 1993 | 21 | 0 |
| 1994 | 33 | 0 |
| 1995 | 23 | 0 |
| 1996 | 41 | 0 |
| 1997 | 49 | 0 |
| 1998 | 80 | 0 |
| 1999 | 115 | 0 |
| 2000 | 246 | 0 |
| 2001 | 372 | 217 |
| 2002 | 495 | 623 |
| 2003 | 563 | 660 |
| 2004 | 533 | 743 |
| 2005 | 565 | 916 |
| 2006 | 571 | 871 |
| 2007 | 546 | 914 |
| 2008 | 556 | 1084 |
| 2009 | 578 | 1036 |
| 2010 | 861 | 1145 |
| 2011 | 949 | 934 |
| 2012 | 927 | 1063 |
| 2013 | 999 | 1066 |
| 2014 | 1101 | 1190 |
| 2015 | 1134 | 1361 |
| 2016 | 1249 | 1198 |
| 2017 | 1286 | 1248 |
| 2018 | 1119 | 1147 |
| 2019 | 1139 | 1296 |
| 2020 | 1270 | 1657 |
| 2021 | 1213 | 1572 |
| 2022 | 1214 | 1617 |
| 2023 | 1229 | 1139 |
| 2024 | 1145 | 1185 |
| 2025 | 935 | 973 |
| 2026 | 462 | 517 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Light emitting display device6 Oct 2026US 12,757,494 B2Samsung Display Co., Ltd.
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Chiplet-fine-interconnection-package structure and method of manufacturing the same6 Oct 2026US 12,757,767 B2Institute of Semiconductors, Guangdong Academy of Sciences
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
- Layer-by-layer formation of through-substrate via8 Oct 2026US 2026/0314369 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0314466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Forming Channels in Encapsulant to Reduce Warpage in Reconstituted Wafer8 Oct 2026US 2026/0314472 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016