H10W 72/9415
Relative to the surface
Official title: {relative to the surface, e.g. recessed, protruding}
H10W72/9415 (Relative to the surface) appears on 10,615 US grants and 12,078 published applications in this corpus.
Search patents in H10W- Granted patents
- 10,615
- Published applications
- 12,078
- Assignees
- 1,339
- Inventors
- 13,701
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 9 | 0 |
| 1995 | 4 | 0 |
| 1996 | 9 | 0 |
| 1997 | 12 | 0 |
| 1998 | 26 | 0 |
| 1999 | 25 | 0 |
| 2000 | 146 | 0 |
| 2001 | 253 | 151 |
| 2002 | 369 | 439 |
| 2003 | 412 | 488 |
| 2004 | 375 | 554 |
| 2005 | 418 | 681 |
| 2006 | 429 | 647 |
| 2007 | 402 | 663 |
| 2008 | 409 | 752 |
| 2009 | 402 | 673 |
| 2010 | 577 | 702 |
| 2011 | 616 | 449 |
| 2012 | 536 | 482 |
| 2013 | 522 | 523 |
| 2014 | 539 | 509 |
| 2015 | 492 | 548 |
| 2016 | 520 | 385 |
| 2017 | 461 | 411 |
| 2018 | 353 | 346 |
| 2019 | 311 | 345 |
| 2020 | 355 | 452 |
| 2021 | 313 | 407 |
| 2022 | 309 | 362 |
| 2023 | 316 | 304 |
| 2024 | 283 | 365 |
| 2025 | 235 | 276 |
| 2026 | 159 | 164 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Radio frequency circuit and memory in thin flexible package895US 5,528,222 AInternational Business Machines Corporation · 1996