Semiconductor Device and Method of Forming Channels in Encapsulant to Reduce Warpage in Reconstituted Wafer

A method of making a semiconductor device, comprising:

• providing a plurality of electrical components;
• depositing an encapsulant over and between the electrical components;
• forming a first channel in a first surface of the encapsulant to extend partially through the encapsulant between the electrical components;
• and
• forming a second channel in a second surface of the encapsulant opposite the first surface of the encapsulant to extend partially through the encapsulant.

A method of making a semiconductor device, comprising:

• providing a plurality of electrical components;
• depositing an encapsulant over the electrical components with a first saw street of the encapsulant separating a first electrical component of the plurality of electrical components from a second electrical component of the plurality of electrical components;
• and
• forming a first channel in a first surface of the encapsulant within the first saw street to reduce stress.

A method of making a semiconductor device, comprising:

• providing a plurality of electrical components;
• depositing an encapsulant over the electrical components;
• and
• forming a first channel in a first surface of the encapsulant within a first saw street of the encapsulant separating the electrical components.