H10W 72/944
Dispositions of multiple bond pads
Official title: {Dispositions of multiple bond pads}
H10W72/944 (Dispositions of multiple bond pads) appears on 7,664 US grants and 8,869 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,664
- Published applications
- 8,869
- Assignees
- 1,048
- Inventors
- 10,979
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 11 | 0 |
| 1992 | 10 | 0 |
| 1993 | 16 | 0 |
| 1994 | 14 | 0 |
| 1995 | 16 | 0 |
| 1996 | 22 | 0 |
| 1997 | 28 | 0 |
| 1998 | 47 | 0 |
| 1999 | 74 | 0 |
| 2000 | 98 | 0 |
| 2001 | 132 | 86 |
| 2002 | 140 | 206 |
| 2003 | 167 | 185 |
| 2004 | 145 | 189 |
| 2005 | 168 | 241 |
| 2006 | 153 | 184 |
| 2007 | 127 | 262 |
| 2008 | 129 | 219 |
| 2009 | 138 | 266 |
| 2010 | 234 | 237 |
| 2011 | 213 | 216 |
| 2012 | 239 | 362 |
| 2013 | 271 | 355 |
| 2014 | 367 | 412 |
| 2015 | 417 | 501 |
| 2016 | 437 | 404 |
| 2017 | 407 | 336 |
| 2018 | 320 | 335 |
| 2019 | 323 | 382 |
| 2020 | 373 | 532 |
| 2021 | 399 | 572 |
| 2022 | 445 | 681 |
| 2023 | 489 | 512 |
| 2024 | 453 | 544 |
| 2025 | 401 | 404 |
| 2026 | 221 | 246 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Flip-chip field effect transistor layouts and structures29 Sep 2026US 12,751,077 B2Wolfspeed, Inc.
- Display device29 Sep 2026US 12,751,160 B2Samsung Display Co., Ltd.
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Layer-by-layer formation of through-substrate via8 Oct 2026US 2026/0314369 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package8 Oct 2026US 2026/0314497 A1Samsung Electronics Co., Ltd.
- Semiconductor device with advanced pad structure and method for forming same1 Oct 2026US 2026/0302085 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0304908 A1Resonac Corporation
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Stackable chip scale semiconductor package with mating contacts on opposed surfaces457US 6,013,948 AMicron Technology, Inc. · 2000