H10W 72/9445
Top-view layouts
Official title: {Top-view layouts, e.g. mirror arrays}
H10W72/9445 (Top-view layouts) appears on 3,929 US grants and 4,217 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,929
- Published applications
- 4,217
- Assignees
- 680
- Inventors
- 6,412
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 10 | 0 |
| 1992 | 9 | 0 |
| 1993 | 16 | 0 |
| 1994 | 14 | 0 |
| 1995 | 16 | 0 |
| 1996 | 22 | 0 |
| 1997 | 24 | 0 |
| 1998 | 47 | 0 |
| 1999 | 72 | 0 |
| 2000 | 90 | 0 |
| 2001 | 121 | 81 |
| 2002 | 131 | 179 |
| 2003 | 147 | 165 |
| 2004 | 129 | 151 |
| 2005 | 149 | 192 |
| 2006 | 122 | 159 |
| 2007 | 100 | 198 |
| 2008 | 109 | 160 |
| 2009 | 117 | 190 |
| 2010 | 163 | 138 |
| 2011 | 146 | 117 |
| 2012 | 126 | 160 |
| 2013 | 152 | 144 |
| 2014 | 172 | 157 |
| 2015 | 151 | 215 |
| 2016 | 177 | 157 |
| 2017 | 173 | 138 |
| 2018 | 116 | 150 |
| 2019 | 145 | 151 |
| 2020 | 144 | 163 |
| 2021 | 121 | 175 |
| 2022 | 154 | 217 |
| 2023 | 127 | 187 |
| 2024 | 146 | 194 |
| 2025 | 152 | 162 |
| 2026 | 103 | 117 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Selective alteration of interconnect pads for direct bonding29 Sep 2026US 12,751,313 B2Adeia Semiconductor Bonding Technologies Inc.
- Stacked chip scale semiconductor device29 Sep 2026US 12,751,326 B2SanDisk Technologies LLC
- Backlight Unit and Display Device Including the Same1 Oct 2026US 2026/0305467 A1LG Display Co., Ltd.
- Semiconductor package and method for manufacturing the same17 Sep 2026US 2026/0282937 A1Samsung Electronics Co., Ltd.
- Method of making semiconductor device having a redistribution line17 Sep 2026US 2026/0282994 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device17 Sep 2026US 2026/0282996 A1Innolux Corporation
- Semiconductor module and method for manufacturing semiconductor module17 Sep 2026US 2026/0282997 A1Nuvoton Technology Corporation Japan
Most cited
By later US patents
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989
- Single piece package for semiconductor die528US 5,739,585 AMicron Technology, Inc. · 1998
- Stackable chip scale semiconductor package with mating contacts on opposed surfaces457US 6,013,948 AMicron Technology, Inc. · 2000