H10W 72/071
Connecting or disconnecting
Official title: {Connecting or disconnecting}
H10W72/071 (Connecting or disconnecting) appears on 52,421 US grants and 56,793 published applications in this corpus.
Search patents in H10W- Granted patents
- 52,421
- Published applications
- 56,793
- Assignees
- 5,028
- Inventors
- 55,268
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 71 | 0 |
| 1977 | 65 | 0 |
| 1978 | 44 | 0 |
| 1979 | 33 | 0 |
| 1980 | 45 | 0 |
| 1981 | 39 | 0 |
| 1982 | 58 | 0 |
| 1983 | 52 | 0 |
| 1984 | 63 | 0 |
| 1985 | 65 | 0 |
| 1986 | 70 | 0 |
| 1987 | 103 | 0 |
| 1988 | 103 | 0 |
| 1989 | 161 | 0 |
| 1990 | 163 | 0 |
| 1991 | 229 | 0 |
| 1992 | 241 | 0 |
| 1993 | 268 | 0 |
| 1994 | 333 | 0 |
| 1995 | 310 | 0 |
| 1996 | 340 | 0 |
| 1997 | 417 | 0 |
| 1998 | 643 | 0 |
| 1999 | 719 | 0 |
| 2000 | 933 | 0 |
| 2001 | 1214 | 611 |
| 2002 | 1305 | 1729 |
| 2003 | 1465 | 1659 |
| 2004 | 1454 | 1890 |
| 2005 | 1339 | 2051 |
| 2006 | 1420 | 2071 |
| 2007 | 1318 | 2107 |
| 2008 | 1171 | 2206 |
| 2009 | 1273 | 2211 |
| 2010 | 1739 | 2132 |
| 2011 | 1833 | 2120 |
| 2012 | 1868 | 2095 |
| 2013 | 1972 | 2164 |
| 2014 | 2083 | 2359 |
| 2015 | 2220 | 2674 |
| 2016 | 2391 | 2404 |
| 2017 | 2370 | 2433 |
| 2018 | 2214 | 2322 |
| 2019 | 2292 | 2562 |
| 2020 | 2339 | 2948 |
| 2021 | 2165 | 2847 |
| 2022 | 2216 | 2812 |
| 2023 | 2184 | 2467 |
| 2024 | 1993 | 2590 |
| 2025 | 1886 | 2118 |
| 2026 | 1129 | 1211 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Pick-and-place tool and method of manufacturing semiconductor structure8 Oct 2026US 2026/0314303 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015