H10W 72/074
Of anisotropic conductive adhesives
Official title: {of anisotropic conductive adhesives}
H10W72/074 (Of anisotropic conductive adhesives) appears on 1,244 US grants and 1,447 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,244
- Published applications
- 1,447
- Assignees
- 409
- Inventors
- 2,343
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 11 | 0 |
| 2001 | 14 | 7 |
| 2002 | 20 | 29 |
| 2003 | 21 | 18 |
| 2004 | 21 | 44 |
| 2005 | 28 | 50 |
| 2006 | 27 | 49 |
| 2007 | 35 | 71 |
| 2008 | 26 | 58 |
| 2009 | 39 | 72 |
| 2010 | 42 | 54 |
| 2011 | 50 | 55 |
| 2012 | 60 | 59 |
| 2013 | 50 | 58 |
| 2014 | 57 | 73 |
| 2015 | 69 | 91 |
| 2016 | 70 | 82 |
| 2017 | 82 | 91 |
| 2018 | 50 | 76 |
| 2019 | 88 | 95 |
| 2020 | 82 | 91 |
| 2021 | 62 | 69 |
| 2022 | 68 | 72 |
| 2023 | 48 | 38 |
| 2024 | 58 | 26 |
| 2025 | 25 | 10 |
| 2026 | 13 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Opto-electronic apparatus and manufacturing method thereof8 Sep 2026US RE51,028 E1LG Display Co., Ltd.
- Adhesive bonding composition and method of use1 Sep 2026US 12,722,358 B2Immunolight, LLC
- Energy augmentation structures for use with energy emitters and collectors11 Aug 2026US 12,702,861 B2Immunolight, LLC
- Power semiconductor module arrangement and method for assembling the same11 Aug 2026US 12,708,033 B2Infineon Technologies AG
- Display device23 Jun 2026US 12,666,822 B2Samsung Display Co., Ltd.
- Adhesive composition, connection structure, and method for producing connection structure24 Sep 2026US 2026/0293740 A1
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Adhesive composition and connection structure20 Aug 2026US 2026/0242640 A1
- Display apparatus including display module and manufacturing method thereof14 May 2026US 2026/0136728 A1Samsung Electronics Co., Ltd.
- Ultra small molded module integrated with die by module-on-wafer assembly14 May 2026US 2026/0136959 A1Intel Corporation
Most cited
By later US patents
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Method of forming a thin wafer stack for a wafer level package232US 7,494,845 B2Samsung Electronics Co., Ltd. · 2009
- Electronic package with strain relief means and method of making224US 5,877,043 AInternational Business Machines Corporation · 1999
- Cavity ball grid array apparatus220US 6,084,297 AMicron Technology, Inc. · 2000