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US 2026/0293741 A1Published application
Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same
OwnerShinnosuke IWAMOTO, Sunao KUDOinventors
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Abstract
An adhesive agent film for circuit connection contains a thermoplastic resin, a thermosetting component, conductive particles, and a non-conductive filler, in which the non-conductive filler includes a non-conductive filler MF having an average linear thermal expansion coefficient of 0 ppb/° C. or less from 30° C. to 150° C.
Claims12
An adhesive agent composition comprising:
- a thermosetting component;
- conductive particles;
- and a non-conductive filler, wherein
- the non-conductive filler includes a non-conductive filler MF having an average linear thermal expansion coefficient of 0 ppb/° C. or less from 30° C. to 150° C.
1 more element
An adhesive agent film for circuit connection, comprising:
- a thermoplastic resin;
- a thermosetting component;
- conductive particles;
- and a non-conductive filler, wherein
- the non-conductive filler includes a non-conductive filler MF having an average linear thermal expansion coefficient of 0 ppb/° C. or less from 30° C. to 150° C.
2 more elements
A circuit connection structure comprising:
- a first circuit member having a first electrode;
- a second circuit member having a second electrode;
- and
- a connection portion disposed between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein
- the connection portion contains conductive particles and a non-conductive filler MF having an average linear thermal expansion coefficient of 0 ppb/° C. or less from 30° C. to 150° C.
2 more elements
Dependencies are inferred from the claim text.