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US 5,877,043 AGranted
Electronic package with strain relief means and method of making
AssigneeInternational Business Machines Corporation
InventorsDavid James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson
Life of this patent
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Abstract
An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
Claims15
A method of making an electronic package comprising the steps of:
- providing a stiffener member;
- securing a flexible circuitized substrate to said stiffener member, said flexible circuitized substrate including at least one dielectric layer and at least one conductive layer located on said dielectric layer and further including a plurality of signal lines, selected ones of said signal lines having a projecting lead portion which projects a predetermined distance from said dielectric layer and is adapted for being electrically coupled to respective ones of external conductive elements when said external conductive elements are positioned on said flexible circuitized substrate;
- providing strain relief means in said projecting lead portions of said signal lines of said flexible circuitized substrate;
- and
- spacedly positioning a semiconductor device relative to said stiffener member and electrically coupling said semiconductor device to said projecting lead portions of said flexible circuitized substrate at a location, said strain relief means being positioned at a location relative to the location of said electrical coupling between said semiconductor device and said projecting lead portions of said signal lines.
2 more elements
Dependencies are inferred from the claim text.