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US 2026/0293740 A1Published application
Adhesive composition, connection structure, and method for producing connection structure
OwnerTakahiro FUKUTOMI, Yuka ITOH +1inventors
InventorsTakahiro FUKUTOMI, Yuka ITOH, Yukino FUKUDA
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Abstract
An object of the present invention is to provide an adhesive composition capable of forming an anisotropic conductive film with which connection resistance between electrodes can be controlled to be low. The present invention is an adhesive composition having a difference between a cure onset temperature and a final cure temperature of 20° C. or less.
Claims8
An adhesive composition having a difference between a cure onset temperature and a final cure temperature of 20° C. or less.
Dependencies are inferred from the claim text.