Opto-electronic apparatus and manufacturing method thereof

A manufacturing method of an opto-electronic apparatus, the manufacturing method comprising steps of:

• disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between a highest point of the matrix circuit and a surface of the substrate;
• disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between a highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness;
• and
• performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material,
• wherein each of the plurality of first protrusion protrusions has a top surface area, which is neater greater than 50% of a bottom surface area of each of the plurality of first opto-electronic unit units.