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US 2026/0242640 A1Published application
Adhesive composition and connection structure
OwnerTakahiro FUKUTOMI, Yuka ITOH +1inventors
InventorsTakahiro FUKUTOMI, Yuka ITOH, Hiroyuki IZAWA
Life of this patent
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Abstract
An adhesive composition containing conductive particles each having a plurality of protrusions on a surface thereof, wherein the conductive particles have a compressive hardness of 350 kgf/mm2 to 1500 kgf/mm2 at 20% compression, and a proportion of an area of the plurality of protrusions to an area of the surface of each conductive particle is 30% or more.
Claims10
A functional coating material comprising a curable component, a polysiloxane compound having an amino group, and a polymerization inhibitor.
Dependencies are inferred from the claim text.