H10W 72/077
Connecting of tab connectors
Official title: {Connecting of TAB connectors}
H10W72/077 (Connecting of tab connectors) appears on 787 US grants and 450 published applications in this corpus.
Search patents in H10W- Granted patents
- 787
- Published applications
- 450
- Assignees
- 248
- Inventors
- 1,178
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 10 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 5 | 0 |
| 1981 | 3 | 0 |
| 1982 | 6 | 0 |
| 1983 | 6 | 0 |
| 1984 | 8 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 7 | 0 |
| 1988 | 12 | 0 |
| 1989 | 18 | 0 |
| 1990 | 14 | 0 |
| 1991 | 21 | 0 |
| 1992 | 26 | 0 |
| 1993 | 20 | 0 |
| 1994 | 23 | 0 |
| 1995 | 14 | 0 |
| 1996 | 21 | 0 |
| 1997 | 20 | 0 |
| 1998 | 39 | 0 |
| 1999 | 23 | 0 |
| 2000 | 29 | 0 |
| 2001 | 47 | 33 |
| 2002 | 49 | 49 |
| 2003 | 39 | 32 |
| 2004 | 18 | 27 |
| 2005 | 26 | 35 |
| 2006 | 23 | 40 |
| 2007 | 30 | 28 |
| 2008 | 27 | 31 |
| 2009 | 18 | 22 |
| 2010 | 17 | 16 |
| 2011 | 17 | 9 |
| 2012 | 9 | 11 |
| 2013 | 13 | 9 |
| 2014 | 7 | 9 |
| 2015 | 12 | 9 |
| 2016 | 8 | 14 |
| 2017 | 10 | 9 |
| 2018 | 15 | 12 |
| 2019 | 14 | 10 |
| 2020 | 7 | 14 |
| 2021 | 14 | 8 |
| 2022 | 6 | 4 |
| 2023 | 5 | 10 |
| 2024 | 6 | 4 |
| 2025 | 6 | 4 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Hybrid bonding apparatus and hybrid bonding method using the same16 Jun 2026US 12,660,667 B2Hanwha Precision Machinery Co., Ltd.
- Electronic component, electric device including the same, and bonding method thereof27 Jan 2026US 12,538,424 B2Samsung Display Co., Ltd.
- Bonding and indexing method20 Jan 2026US 12,532,763 B2Nexperia B. V.
- Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package7 Oct 2025US 12,435,248 B2
- Semiconductor device package assemblies with direct leadframe attachment27 May 2025US 12,315,826 B2Semiconductor Components Industries, LLC
- Electronic component, electric device including the same, and bonding method thereof14 May 2026US 2026/0136465 A1Samsung Display Co., Ltd.
- Display device14 Aug 2025US 2025/0258410 A1Samsung Display Co., Ltd.
- Semiconductor packages with an intermetallic layer19 Jun 2025US 2025/0201753 A1Semiconductor Components Industries, LLC
- Semiconductor packages with an intermetallic layer5 Jun 2025US 2025/0183217 A1Semiconductor Components Industries, LLC
- Flexible interposer27 Mar 2025US 2025/0105131 A1Pragmatic Semiconductor Limited
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Method for producing high speed integrated circuits354US 5,214,845 AMicron Technology, Inc. · 1993
- Lead connections means for stacked tab packaged IC chips312US 5,138,438 AAkita Electronics Co., Ltd. · 1992
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008
- Attaching an electronic circuit to a substrate274US 5,566,441 ABritish Technology Group Limited · 1996