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US 12,315,826 B2Granted
Semiconductor device package assemblies with direct leadframe attachment
AssigneeSemiconductor Components Industries, LLC
InventorsSeungwon Im, Oseob Jeon
Life of this patent
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Abstract
In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive.
Claims19
A semiconductor device package comprising:
- a substrate;
- a semiconductor die disposed on and coupled with the substrate, the semiconductor die being made of silicon carbide;
- and
- a leadframe including a planar body having an indentation disposed therein, the indentation defining a recess in the planar body, the recess defining an opening in the planar body, the opening having a continuous perimeter, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive,
- the indentation including:
- a first tab having a first contact surface coupled with the semiconductor die;
- and
- a second tab having a second contact surface coupled with the semiconductor die.
5 more elements
A semiconductor device package comprising:
- a substrate;
- a first semiconductor die disposed on and coupled with the substrate, the first semiconductor die being made of silicon carbide;
- a second semiconductor die disposed on and coupled with the substrate, the second semiconductor die being made of silicon carbide;
- a leadframe including:
- a first leadframe portion including a first planar body having a first indentation disposed therein, the first indentation defining a recess that is wholly disposed within an interior of the first planar body, a contact surface of the first indentation being disposed on and coupled with the first semiconductor die;
- and
- a second leadframe portion including a second planar body having a second indentation disposed therein, the second indentation defining a recess that is wholly disposed within an interior of the second planar body, a contact surface of the second indentation being disposed on and coupled with the second semiconductor die;
- and conductive adhesive that:
- couples the contact surface of the first indentation with the first semiconductor die;
- and
- couples the contact surface of the second indentation with the second semiconductor die,
- the contact surface of the first indentation includes a first contact surface and a second contact surface, the first indentation including:
- a first tab including the first contact surface, the first tab being coupled with the first semiconductor die;
- and
- a second tab having the second contact surface, the second tab being coupled with the first semiconductor die.
12 more elements
Dependencies are inferred from the claim text.