Bonding and indexing method
AssigneeNexperia B.V.
InventorsRalph Huybers, Hans Van De Rijdt
Life of this patent
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Abstract
A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.
Claims20
A method for bonding and indexing a substrate and an element with a bonding and indexing apparatus, comprising:
- moving the substrate in an indexing direction from a first position to a second position with a first index head of the bonding and indexing apparatus;
- moving the substrate in an indexing direction from the second position to a third position with a second index head of the bonding and indexing apparatus;
- wherein at least one of the first index head and the second index head further comprises a bonding element configured to effect a bonding process between the substrate and the element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by any index head selected from the group consisting of the first index head, the second index head, and any combination of the first index head and the second index head of the bonding and indexing apparatus.
Dependencies are inferred from the claim text.