Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package

A temporary protective film for semiconductor encapsulation molding, comprising:

• a support film;
• and an adhesive layer provided on one surface or both surfaces of the support film, wherein
• the adhesive layer comprises
• a thermoplastic resin, and
• at least one compound selected from the group consisting of sorbitol polyglycidyl ether, polyethylene glycol diglycidyl ether, a glycidyl ether of an aliphatic alcohol having 10 to 20 carbon atoms, glycerol polyglycidyl ether, a polyalkylene glycol ester of a fatty acid having 2 to 30 carbon atoms, a dipentaerythritol ester of a fatty acid having 2 to 20 carbon atoms, polyethylene glycol monoalkyl ether, and polyethylene glycol dialkyl ether, and
• wherein the thermoplastic resin comprises at least one selected from the group consisting of an aromatic polyether amideimide, an aromatic polyether imide, an aromatic polyether amide, an aromatic polyamide, an aromatic polyester, an aromatic polyimide, an aromatic polyamideimide, an aromatic polyether, and an aromatic polyester imide.