Pick-and-place tool and method of manufacturing semiconductor structure

A pick-and-place tool, comprising:

• a bond base;
• an attaching head connected to the bond base and configured to attract a chip by a suction force, wherein the attaching head has an attaching surface that is convex toward the chip, the attaching head has a plurality of suction holes penetrating the attaching surface, and the attaching head attracts the chip using the suction force via the suction holes;
• and
• a flexible element mounted on the attaching surface of the attaching head, the flexible element comprising a plurality of through holes each connecting to one of the suction holes of the attaching head.

A method of manufacturing a semiconductor structure, comprising:

• providing a pick-and-place tool comprising an attaching head having a convex surface;
• bringing the convex surface of the attaching head towards a chip to attract the chip by a suction force, wherein the chip deforms according to the convex surface of the attaching head when being attracted by the attaching head;
• applying a first suction force on an edge portion of the chip and applying a second suction force, which is smaller than the first suction force, on a center portion of the chip to deform the chip;
• and
• bonding the chip to a package substrate by the pick-and-place tool.