H10W 72/0711
Apparatus therefor
Official title: {Apparatus therefor}
H10W72/0711 (Apparatus therefor) appears on 5,855 US grants and 5,698 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,855
- Published applications
- 5,698
- Assignees
- 1,205
- Inventors
- 9,178
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 20 | 0 |
| 1977 | 16 | 0 |
| 1978 | 13 | 0 |
| 1979 | 7 | 0 |
| 1980 | 11 | 0 |
| 1981 | 11 | 0 |
| 1982 | 12 | 0 |
| 1983 | 14 | 0 |
| 1984 | 23 | 0 |
| 1985 | 10 | 0 |
| 1986 | 23 | 0 |
| 1987 | 21 | 0 |
| 1988 | 28 | 0 |
| 1989 | 39 | 0 |
| 1990 | 49 | 0 |
| 1991 | 47 | 0 |
| 1992 | 60 | 0 |
| 1993 | 67 | 0 |
| 1994 | 74 | 0 |
| 1995 | 61 | 0 |
| 1996 | 59 | 0 |
| 1997 | 88 | 0 |
| 1998 | 84 | 0 |
| 1999 | 137 | 0 |
| 2000 | 149 | 0 |
| 2001 | 185 | 91 |
| 2002 | 181 | 187 |
| 2003 | 169 | 197 |
| 2004 | 143 | 186 |
| 2005 | 119 | 220 |
| 2006 | 139 | 222 |
| 2007 | 131 | 221 |
| 2008 | 124 | 243 |
| 2009 | 155 | 262 |
| 2010 | 221 | 251 |
| 2011 | 194 | 222 |
| 2012 | 197 | 219 |
| 2013 | 193 | 225 |
| 2014 | 184 | 220 |
| 2015 | 215 | 277 |
| 2016 | 231 | 251 |
| 2017 | 208 | 248 |
| 2018 | 215 | 239 |
| 2019 | 217 | 222 |
| 2020 | 234 | 286 |
| 2021 | 205 | 272 |
| 2022 | 208 | 238 |
| 2023 | 218 | 210 |
| 2024 | 183 | 197 |
| 2025 | 161 | 169 |
| 2026 | 102 | 123 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/07141Means for applying energy3,413
- H10W 72/07178Means for aligning1,357
- H10W 72/07173Means for moving chips, wafers or other parts838
- H10W 72/07183Means for monitoring552
- H10W 72/07131Means for applying material345
- H10W 72/07168Means for storing or moving the material for the connector340
- H10W 72/07125Means for controlling the bonding environment254
- H10W 72/07188Apparatus chuck160
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- IC chip mounting device and IC chip mounting method29 Sep 2026US 12,751,255 B2Sato Holdings Kabushiki Kaisha/ Sato Corporation
- Wire bonding arrays, maintenance stations for wire bonding arrays, and related methods22 Sep 2026US 12,745,664 B2Kulicke and Soffa Industries, Inc.
- Wire bonding apparatus and control method8 Sep 2026US 12,728,478 B2Kioxia Corporation
- Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the method8 Sep 2026US 12,733,527 B2JMJ Korea Co., Ltd.
- Method and system for measuring and correcting die alignment error1 Oct 2026US 2026/0298625 A1
- Mounting head and mounting apparatus having the mounting head1 Oct 2026US 2026/0305436 A1Shibaura Mechatronics Corporation
- Mounting device and method for detecting displacement1 Oct 2026US 2026/0305437 A1Yamaha Robotics Co., Ltd.
- Joining correction method24 Sep 2026US 2026/0284795 A1Tazmo Co., Ltd.
- Reflow method and system17 Sep 2026US 2026/0273640 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method for making semiconductor device having no die supporting surface430US 5,474,958 AMotorola, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994