IC chip mounting device and IC chip mounting method

An IC chip mounting apparatus comprising:

• an ejection unit configured to eject an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material;
• a conveyor configured to convey the antenna continuous body on a conveying surface;
• a nozzle movable between a first position and a second position, the nozzle being configured to suck an IC chip when located at the first position, and to place the IC chip on the adhesive at the reference position of each antenna when located at the second position;
• a nozzle attachment to which the nozzle is attached;
• a rotating unit configured to rotate the nozzle attachment such that (i) the nozzle moves along a circular track in a plane orthogonal to the conveying surface, and (ii) a moving direction of the nozzle at the second position matches a conveying direction of the antenna continuous body;
• a processor configured to determine whether an IC chip is sucked by the nozzle while the nozzle is moved from the first position to the second position;
• and
• a moving machine configured to move the nozzle away from the second position when it is determined by the processor that an IC chip is not sucked by the nozzle while the nozzle is moved from the first position to the second position, wherein the moving machine moves the nozzle attachment in a width direction of the antenna continuous body.

An IC chip mounting method comprising:

• ejecting, by a dispenser, an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material;
• conveying the antenna continuous body on a conveying surface:
• performing a sucking operation for sucking an IC chip, by a nozzle, when the nozzle is located at a first position;
• rotating a nozzle attachment to which the nozzle is attached such that (i) the nozzle moves from the first position to a second position along a circular track around a rotation center in a plane orthogonal to the conveying surface, and (ii) a moving direction of the nozzle at the second position matches a conveying direction of the antenna continuous body:
• determining whether the IC chip is sucked by the nozzle while the nozzle is moved from the first position to the second position;
• if it is determined that an IC chip is sucked by the nozzle, placing the IC chip by the nozzle on the adhesive at the reference position of a respective antenna when the nozzle is located at the second position;
• and
• if it is determined that an IC chip is not sucked by the nozzle, moving the nozzle away from the second position, wherein moving the nozzle is performed by moving the nozzle toward the rotation center.

An IC chip mounting method comprising:

• ejecting, by a dispenser, an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material:
• conveying the antenna continuous body on a conveying surface:
• performing a sucking operation for sucking an IC chip, by a nozzle, when the nozzle is located at a first position:
• rotating a nozzle attachment to which the nozzle is attached such that (i) the nozzle moves from the first position to a second position along a circular track in a plane orthogonal to the conveying surface, and (ii) a moving direction of the nozzle at the second position matches a conveying direction of the antenna continuous body;
• determining whether the IC chip is sucked by the nozzle while the nozzle is moved from the first position to the second position;
• if it is determined that an IC chip is sucked by the nozzle, placing the IC chip by the nozzle on the adhesive at the reference position of a respective antenna when the nozzle is located at the second position;
• and
• if it is determined that an IC chip is not sucked by the nozzle, moving the nozzle away from the second position by moving the nozzle attachment in a width direction of the antenna continuous body.

An IC chip mounting method comprising:

• ejecting, by a dispenser, an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material;
• performing a sucking operation for sucking an IC chip, by a nozzle, when the nozzle is located at a sucking position;
• determining whether the IC chip is sucked by the nozzle;
• if it is determined that the IC chip is sucked by the nozzle, placing the IC chip by the nozzle on the adhesive at the reference position of a respective antenna when the nozzle is located at a placing position;
• if it is determined that an IC chip is not sucked by the nozzle, moving the nozzle to a position that is neither a sucking position or a placing position.