H10W 72/07113
Means for calibration
Official title: {Means for calibration}
H10W72/07113 (Means for calibration) appears on 25 US grants and 29 published applications in this corpus.
Search patents in H10W- Granted patents
- 25
- Published applications
- 29
- Assignees
- 15
- Inventors
- 60
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 2 | 3 |
| 2016 | 3 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 2 |
| 2019 | 0 | 2 |
| 2020 | 2 | 4 |
| 2021 | 2 | 1 |
| 2022 | 2 | 1 |
| 2023 | 3 | 5 |
| 2024 | 2 | 4 |
| 2025 | 5 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of calibrating an ultrasonic characteristic on a wire bonding system30 Jun 2026US 12,667,906 B2Kulicke and Soffa Industries, Inc.
- Method of manufacturing semiconductor package11 Nov 2025US 12,469,749 B2Samsung Electronics Co., Ltd.
- Compression system calibration19 Aug 2025US 12,394,746 B2The Boeing Company
- Manufacturing apparatus and manufacturing method of semiconductor device29 Jul 2025US 12,374,650 B2Kabushiki Kaisha Shinkawa
- Methods of operating die attach systems29 Apr 2025US 12,288,711 B2Assembleon N.V.
- Semiconductor Substrate Bonder with Enhanced Alignment via Digital Twin and Machine Learning30 Apr 2026US 2026/0123501 A1Inspiring Atoms Pte Ltd
- Mounting apparatus, mounting method, and computer-readable recording medium2 Apr 2026US 2026/0096460 A1Kabushiki Kaisha Shinkawa
- Die attach systems, and methods for integrated accuracy verification and calibration using such systems17 Jul 2025US 2025/0233000 A1Assembleon N.V.
- Methods of calibrating an ultrasonic characteristic on a wire bonding system5 Dec 2024US 2024/0404986 A1Kulicke and Soffa Industries, Inc.
- Bonding method, bonding apparatus, article manufacturing method, determination method, information processing apparatus, and storage medium18 Jul 2024US 2024/0243094 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Bonding apparatus with means and method for automatic calibration using pattern recognition36US 4,759,073 AKulicke and Soffa Industries, Inc. · 1988
- Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip9US 11,114,406 B2SanDisk Technologies LLC · 2021
- Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements6US 9,136,243 B2Kulicke and Soffa Industries, Inc. · 2015
- Methods of operating bonding machines for bonding semiconductor elements, and bonding machines3US 9,478,516 B2Kulicke and Soffa Industries, Inc. · 2016
- Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements2US 9,425,163 B2Kulicke and Soffa Industries, Inc. · 2016