Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
AssigneeKulicke and Soffa Industries, Inc.
InventorsMichael P. Schmidt-Lange, Matthew B. Wasserman, Christopher W. Braun
Life of this patent
Estimating the term…
Abstract
A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
Claims21
A method of determining a level of parallelism between a bonding tool and a support structure of a bonding machine, the method comprising the steps of:
- (a) positioning a contact portion of a calibration tool between the bonding tool and the support structure;
- (b) lowering the bonding tool to drive the contact portion of the calibration tool to a contact position within a bonding location of the support structure where the contact portion of the calibration tool contacts the bonding tool and the contact position simultaneously;
- and
- (c) determining a z-axis height value for the contact position when each of the bonding tool and the support structure is in contact with the contact portion of the calibration tool.
A method of determining a level of parallelism between a contact portion of a bonding tool and a contact region of a flux station of a bonding machine, the method comprising the steps of:
- (a) positioning a contact portion of a calibration tool between the bonding tool and the contact region of the flux station;
- (b) lowering the bonding tool to drive the contact portion of the calibration tool to a contact position within the contact region of the flux station where the contact portion of the calibration tool contacts the contact portion of the bonding tool and the contact position within the contact region of the flux station simultaneously;
- and
- (c) determining a z-axis height value for the contact position within the contact region of the flux station when each of the contact portion of the bonding tool and the contact region of the flux station is in contact with the contact portion of the calibration tool.
Dependencies are inferred from the claim text.