Manufacturing apparatus and manufacturing method of semiconductor device
AssigneeKabushiki Kaisha Shinkawa
InventorsShigeru Hayata, Osamu Kakutani
Life of this patent
Estimating the term…
Abstract
A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the capillary. The controller positions the capillary with respect to the workpiece based on the first image, and calculates a positioning correction amount of the capillary based on the second image.
Claims10
A manufacturing apparatus of a semiconductor device, comprising:
- a tool, performing predetermined processing on a workpiece and movable with respect to the workpiece;
- an optical mechanism, moving together with the tool;
- and
- a controller,
- wherein the optical mechanism comprises:
- a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range;
- and
- a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the tool,
- wherein the controller positions the tool with respect to the workpiece based on the first image, and calculates a positioning correction amount of the tool based on the second image,
- the first imaging unit and the second imaging unit have an imaging element in common;
- the first imaging unit comprises a first optical element group that guides a first field light being light from the standard point to the imaging element;
- the second imaging unit comprises a second optical element group that guides a second field light being light from the reference point to the imaging element;
- a second optical path being an optical path of the second field light joins a first optical path being an optical path of the first field light at a junction located halfway from the reference point to the imaging element.
A manufacturing method of a semiconductor device, manufacturing a semiconductor device by performing predetermined processing on a workpiece by a tool movable with respect to the workpiece, wherein the manufacturing method comprises:
- imaging a standard point set within an imaging range and acquiring a first image by a first imaging unit movable together with the tool;
- imaging a reference point formed at a predetermined distance from the tool and acquiring a second image by a second imaging unit movable together with the tool and the first imaging unit;
- positioning the tool with respect to the workpiece based on the first image;
- and
- calculating a positioning correction amount of the tool based on the second image,
- wherein the first imaging unit and the second imaging unit have an imaging element in common;
- the first imaging unit comprises a first optical element group that guides a first field light being light from the standard point to the imaging element;
- the second imaging unit comprises a second optical element group that guides a second field light being light from the reference point to the imaging element;
- a second optical path being an optical path of the second field light joins a first optical path being an optical path of the first field light at a junction located halfway from the reference point to the imaging element.
Dependencies are inferred from the claim text.