Back to results
US 2026/0123501 A1Published application
Semiconductor Substrate Bonder with Enhanced Alignment via Digital Twin and Machine Learning
AssigneeInspiring Atoms Pte Ltd
InventorYang Pan
Life of this patent
Estimating the term…
Abstract
The present invention relates to a high-precision substrate alignment method and system for semiconductor bonding, utilizing advanced sensory systems, digital twin technology, and machine learning. Unique alignment marks, such as 2D barcodes and varied critical dimension (CD) grids, capture precise positional information of substrates in 3D space. This system optimizes movement trajectories for substrate bonding, significantly improving alignment accuracy and process efficiency.
Claims20
An alignment system for a bonder, comprising:
- a sensory system configured to detect alignment marks on a base substrate and a top substrate, wherein said alignment marks are implemented as a 2D barcode or a varied critical dimension (CD) grid, wherein the alignment marks provide 2D positional information to guide the movement of substrates during an alignment process;
- a movable stage operably supported the base substrate, wherein said stage is configured to move the base substrate in at least two directions in a plane;
- a moving mechanism operably connected to a bonding head holding the top substrate, wherein said moving mechanism is configured to position the top substrate relative to the base substrate with movement in multiple degrees of freedom;
- and
- a system controller configured to determine, in a 3D space with the same coordinate system, the positions of the base substrate, and the top substrate based on data captured by the sensory system and to generate operating parameters for bringing the base substrate and the top substrate to aligned positions for bonding or pre-bonding.
2 more elements
A method for aligning substrates by a system controller, comprising:
- detecting alignment marks on a base substrate and a top substrate using a sensory system, wherein said alignment marks provide 2D positional information to guide movement of the substrates during an alignment process;
- determining the positions of the base substrate and the top substrate in a 3D space using a digital twin that captures the positions of the substrates with the same coordinate system;
- generating operating parameters based on the determined positions, wherein said operating parameters are used to move a movable stage holding the base substrate and a moving mechanism for a bonding head holding the top substrate;
- and
- moving the base substrate using the stage and the top substrate using the moving mechanism in response to the generated operating parameters to bring the substrate into aligned positions for bonding or pre-bonding.
2 more elements
A bonder for bonding a base substrate and a top substrate, comprising:
- a. an alignment system, including:
- a sensory system configured to detect alignment marks on a base substrate and a top substrate, wherein said alignment marks are implemented as a 2D barcode or a varied critical dimension (CD) grid, wherein the alignment marks provide 2D positional information to guide the movement of substrates during an alignment process;
- a movable stage operably supported the base substrate, wherein said stage is configured to move the base substrate in at least two directions in a plane;
- a moving mechanism operably connected to a bonding head holding the top substrate, wherein said moving mechanism is configured to position the top substrate relative to the base substrate with movement in multiple degrees of freedom;
- a system controller configured to determine, in a 3D space with the same coordinate system, the positions of the base substrate and the top substrate based on data captured by the sensory system and to generate operating parameters for bringing the base substrate and the top substrate to aligned positions for pre-bonding step of a hybrid bonding process;
- and
- b. a bonding head holding the top substrate for initiating the pre-bonding step.
4 more elements
Dependencies are inferred from the claim text.