Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
AssigneeKulicke and Soffa Industries, Inc.
InventorsMatthew B. Wasserman, Michael P. Schmidt-Lange, Thomas J. Colosimo, Jr.
Life of this patent
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Abstract
A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.
Claims15
A bonding machine for bonding semiconductor elements, the bonding machine comprising:
- a bond head assembly including a bonding tool for bonding semiconductor elements to a substrate;
- a support structure for supporting the substrate during bonding of the semiconductor elements to the substrate;
- a calibration station used in connection with the bond head assembly for measuring a time based z-axis height measurement characteristic of the bond head assembly during a model bonding process;
- and
- a computer for determining a z-axis adjustment profile to provide compensation during a subsequent bonding process based on the measured time based z-axis height measurement characteristic.
A bonding machine for bonding semiconductor elements, the bonding machine comprising:
- a bond head assembly including a bonding tool for bonding semiconductor elements to a substrate;
- a support structure for supporting the substrate;
- a calibration station used in connection with the bond head assembly for measuring a time based z-axis height measurement characteristic of the bond head assembly during a model bonding process;
- and
- a computer for determining a z-axis adjustment profile to provide compensation during a subsequent bonding process based on the measured time based z-axis height measurement characteristic, wherein the calibration station is coupled to the support structure and moves along with the support structure along at least one motion axis.
Dependencies are inferred from the claim text.