Methods of operating die attach systems

A method of operating a die attach system, the method comprising steps of:

• providing the die attach system, the die attach system including (i) a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers, (ii) an imaging element, (iii) a bond tool configured to contact each of the plurality of die during a transfer from a die supply source to the verification substrate, and (iv) a supply support for supporting the die supply source, the die supply source being positioned between the bond tool and the verification substrate;
• imaging each of the plurality of die with respective ones of the plurality of substrate reference markers in a single field-of-view using the imaging element from the die attach system;
• and
• determining an alignment of the plurality of die with the verification substrate using an image taken during imaging of each of the plurality of die with respective ones of the plurality of substrate reference markers.