Bonding method, bonding apparatus, article manufacturing method, determination method, information processing apparatus, and storage medium

A bonding apparatus comprising:

• a bonder configured to bond each of a plurality of first objects to a first substrate;
• and
• a controller configured to determine, as an offset amount, an amount to offset a bonding position on the first substrate from a design position for each of the plurality of first objects, and control bonding of each of the plurality of first objects to the first substrate by the bonder based on the offset amount,
• wherein after the bonding, a process of bonding a plurality of second objects which are bonded to a second substrate, to the plurality of first objects bonded to the first substrate is performed,
• wherein the controller determines the offset amount to satisfy a predetermined condition based on arrangement information representing an arrangement of the plurality of second objects on the second substrate, and
• wherein the predetermined condition includes a first condition to electrically connect each of the plurality of first objects and the first substrate after the bonding is performed, and a second condition to electrically connect each of the plurality of first objects and a corresponding one of the plurality of second objects after the process is performed.