Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
AssigneeKulicke and Soffa Industries, Inc.
InventorsMichael P. Schmidt-Lange, Matthew B. Wasserman, Christopher W. Braun
Life of this patent
Estimating the term…
Abstract
A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
Claims24
A bonding machine for bonding semiconductor elements, the bonding machine comprising:
- a support structure configured to support a substrate;
- a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate;
- and
- a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation,
- the contact portion of the calibration tool being moved by the bonding tool, and brought into contact with the support structure through movement of the bonding tool.
A bonding machine for bonding semiconductor elements, the bonding machine comprising:
- a support structure configured to support a substrate;
- a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate;
- a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation, the contact portion of the calibration tool being configured to contact a plurality of bonding locations of the support structure to determine z-axis position data for each of the plurality of bonding locations, the z-axis position data for each of the plurality of bonding locations including z-axis height values for a plurality of positions within respective ones of the plurality of bonding locations;
- and
- a computer system configured to receive the z-axis position data, and to determine if the z-axis position data for each of the plurality of bonding locations meets predetermined criteria.
A bonding machine for bonding semiconductor elements, the bonding machine comprising:
- a support structure configured to support a substrate;
- a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate;
- and
- a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation, the contact portion of the calibration tool including two opposing contact portions defining respective spherical surfaces.
Dependencies are inferred from the claim text.