Methods of calibrating an ultrasonic characteristic on a wire bonding system
AssigneeKulicke and Soffa Industries, Inc.
InventorsJon W. Brunner, Wei Qin, Aashish Shah, Hui Xu, Jeong Ho Yang
Life of this patent
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AssigneeKulicke and Soffa Industries, Inc.
InventorsJon W. Brunner, Wei Qin, Aashish Shah, Hui Xu, Jeong Ho Yang
Estimating the term…
A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
A method of calibrating an ultrasonic characteristic on a wire bonding system to be calibrated, the method comprising the steps of:
A method of calibrating an ultrasonic characteristic on a wire bonding system to be calibrated, the method comprising the steps of:
Dependencies are inferred from the claim text.